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April 3, 2019Journal of Electronic Packaging

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

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Authors

ABAvram Bar‐CohenIntel (United States)JMJoseph MaurerDADavid AltmanRTX (United States)

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Cite This Study

Bar‐Cohen et al. (2019) studied this question.

synapsesocial.com/papers/6a9b0e768b015ed9458dc7a8https://doi.org/10.1115/1.4043404
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