The precipitation hardened high‐copper alloy CuNi1Co1Si (UNS design. C70350) was developed in two tempers in a high strength spring material for small connector devices. The combination of high strength, moderate conductivity, excellent thermal stability and good formability is explained by the microstructure of the strip material. In comparison to the nickel silicide hardened connector material CuNi3Si (C70250) the cobalt containing mixed silicides improve significantly strength. The weak anisotropy of the spring characteristics is explained by a process‐dependent texture. The good formability is calculated by FEM and proven by standardized bend test, as well as by manufacturing a demonstration part which is similar to a connector.
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Kuhn et al. (2007) studied this question.
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