Answers are grounded in this paper and cite their sources.
Porous silicon micro-particulates have been harvested after electrochemical anodization of lightly-doped p-type silicon wafers in hydrofluoric acid electrolyte containing sulfuric acid as an additive. Post-anodization, significantly higher internal surface areas per unit mass have been realized by utilizing super-critical drying with CO 2 solvent instead of air-drying, with up to 1125 m 2 /g being achieved. Correspondingly higher pore volumes are also evident (>1 cm 3 /g) and, with average pore diameters ranging between 3–4 nm, a higher micropore content is made accessible. It is proposed that the improvements achieved through super-critical drying indicate that the higher density of micropores expected from the choice of wafer resistivity and electrolyte composition (their presence being confirmed through analysis of the adsorption-desorption isotherms) is facilitated through a higher degree of integrity being maintained within the etched pore structure during electrolyte removal.
No takes yet. Share an insight, caveat, or question.
Loni et al. (2015) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: