In this work, we demonstrate highly scaled, non-volatile memory transistors with ferroelectric Zr-doped HfO2(HZO) as gate insulator.Ω-gate transistors with gate length ~30 nm and width ~85 nm were fabricated on ~20 nm thick SOI. We demonstrate robust memory operation with ≤100 ns program and erase speed at ±5 V, projected memory retention time up to 10 years at 85 °C, and ~0.5 V memory window after 108endurance cycles. The impact ofV Don erase speed provides insights into the importance of holes on memory operation.
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Bae et al. (2020) studied this question.
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