Low dielectric and high thermal conductivity epoxy nanocomposites filled with NH2‐POSS/n‐BN hybrid fillers

Hybrid fillers of mono‐amine polyhedral oligomeric silsesquioxane/nanosized boron nitride (NH2‐POSS/n‐BN) were performed to fabricate NH2‐POSS/n‐BN/epoxy nanocomposites. Results revealed that the dielectric constant and dielectric loss values were decreased with the increasing addition of NH2‐POSS obviously, but increased with the increasing addition of BN fillers. For a given loading of NH2‐POSS (5 wt %), the thermal conductivities of NH2‐POSS/n‐BN/epoxy nanocomposites were improved with the increasing addition of n‐BN fillers, and the thermal conductivity of the nanocomposites was 1.28 W/mK with 20 wt % n‐BN fillers. Meantime, the thermal stability of the NH2‐POSS/n‐BN/epoxy nanocomposites was also increased with the increasing addition of n‐BN fillers.