A new packaging technique for field accessed bubble devices, named "REFLECTION COIL PACKAGING", is proposed. The "REFLECTION COIL PACKAGING", comprising flat coils and a conductor plate with attached bubble chips, is characterized by ease of assembly, good thermal properties and low induced noise; it also has a potential capability for high-speed (up to 1 MHz) operations. Described in this paper are the concept of the "REFLECTION COIL PACKAGING", its basic characteristics and experimental results on the prototype high-speed module.
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Takasu et al. (1975) studied this question.
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