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Experimental study demonstrates enhanced thermal, electrical, and mechanical properties in epoxy resins modified with silsesquioxane, indicating strong potential for printed circuit boards.
Octaaminophenyl polyhedral oligomeric silsesquioxane (OAPS) was synthesized using three‐step method and used to modify o‐cresol‐novolac epoxy resin (ECN) for printed circuit board. The influence of OAPS on the reactivity and the final properties of the hybrid networks were evaluated. The intercrosslinking reaction between ECN and OAPS was confirmed by Fourier transform infrared spectra. The ECN/OAPS hybrids have better impact strength, higher electrical resistivity and thermal stability, lower water absorption than the unmodified ECN. The volume resistivity and surface resistivity of the hybrids increase by an order of magnitude or more compared to the neat epoxy. The thermal stability of the hybrids improves by the incorporation of OAPS; the initial decomposition temperature and char yield show an increasing tendency up to 4 wt% loading of OAPS. The hybrids exhibit higher storage modulus and glass transition temperature (Tg) than the neat epoxy. The Tg of the hybrids greatly improves up to 153.3°C at 3 wt% content, much higher than 119.4°C of the neat epoxy. POLYM. COMPOS., 34:1753–1760, 2013.
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Ding et al. (2013) studied this question.
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