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The rapid growth of portable electronics requires a multifunctional composite with superior thermal management capabilities, mechanical strength, and thermal stability. Overheating at operating temperatures is destructive to the durability of electronic devices. The primary goal of this work is to improve heat conductivity and optimize the best combination of ZrO 2 and modified BN wt% ratio, which could be a preferable choice for structural and thermal management applications. Modified ZrO 2 ‐BN (ZBN)‐embedded CF/EP composites are fabricated using the vacuum‐assisted resin transfer molding technique. The tensile strength, flexural strength, impact energy, and microhardness are enhanced by ≈43%, 51%, 12%, and 52%, respectively. In addition, the thermal conductivity of the composite is improved by ≈87%, along with very low specific heat capacity compared to the neat CF/EP composite. The proposed composite is intended for thermal interface applications, including heat exchangers, aviation thermal control systems, and structural applications.
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Kuila et al. (2025) studied this question.
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