The handling and assembling of microcomponents is usually considered as a bottleneck in the fabrication process of hybrid microsystems. This is especially true for very small components that require high positioning tolerances. In this paper we present gripping solutions for various applications concerning the handling and assembling of microcomponents as well as the major microgripper manufacturing technologies.
No takes yet. Share an insight, caveat, or question.
Ansel et al. (2002) studied this question.
Synapse has enriched 5 related papers. Consider them for comparative context: