The pulsed electrodepostion of copper has been systematically investigated from a copper sulphate bath. Pulse duty cycles of 5–80%, at frequencies from 10 to 100 Hz with current densities ranging from 2·5 to 7·5 A dm−2 were employed. The influences of pulsed current duty cycle, peak current density and frequency on the thickness and hardness of the copper deposit, current efficiency and throwing power of the plating process were studied. The effect of additives, polyethylene glycol and di-sodium EDTA on the properties of deposit were investigated.
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Mohan et al. (2005) studied this question.
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