Smooth mesoporous silica films (see Figure) can now be obtained with very low dielectric constants by spin coating, whereby the thickness and hydrophobicity of the films can also be controlled. This is thanks to a functionalized precursor as is unveiled in this communication. These films are sure to be on the wanted list for semiconductor applications as they combine dielectric stability with a low processing temperature, an excellent thermal stability, and reliable mechanical properties.
No takes yet. Share an insight, caveat, or question.
Yang et al. (2001) studied this question.