The reverse current in a p+-n silicon junction irradiated by high-energy helium ions was measured as a function of time at room temperature. A rather large exponential decrease of the reverse current has been observed and the measured time constant is 3±0.2 days. Defect profiling by current-voltage characteristics indicates that the damage recombination occurs without long-range migration of defects. The defects responsible for the reverse current of irradiated silicon diodes after the long room-temperature aging are characterized by an energy level 0.11 eV above Si midgap.
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Germaná et al. (1992) studied this question.
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