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A chemically amplified photosensitive and thermosetting polymer based on poly[2,6‐di(3‐methyl‐2‐butenyl)phenol (15 mol %)‐co‐2,6‐dimethylphenol (85 mol %)] (3c) and a photoacid generator [(5‐propylsulfonyloxyimino‐5H‐thiophen‐2‐ylidene)‐(2‐methylphenyl)acetonitrile] was developed. Poly[2,6‐bis(3‐methyl‐2‐butenyl)phenol]‐co‐2,6‐dimethylphenol)] (3) with high molecular weights (number‐average molecular weight ∼ 24,000) was prepared by the oxidative coupling copolymerization of 2,6‐di(3‐methyl‐2‐butenyl)phenol with 2,6‐dimethylphenol in the presence of copper(I) chloride and pyridine as the catalyst under a stream of oxygen. The structures of 3 were characterized with IR, 1H NMR, and 13C NMR spectroscopy. 3 was crosslinked by a thermal treatment at 300 °C for 1 h under N2. The 5% weight loss temperatures and glass‐transition temperatures of the cured copolymers reached around 420 °C in nitrogen and 300 °C, respectively. The average refractive index of the cured copolymer (3c) film was 1.5452, from which the dielectric constant at 1 MHz was estimated to be 2.6. The resist showed a sensitivity of 35 mJ cm−2 and a contrast of 1.6 when it was exposed to 436‐nm light, postexposure‐baked at 145 °C for 5 min, and developed with toluene at 25 °C. A fine negative image featuring 8‐μm line‐and‐space patterns was obtained on a film exposed to 100 mJ cm−2 with 436‐nm light in the contact‐printed mode.
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Matsumoto et al. (2004) studied this question.
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