A dynamic loading test at a slow strain rate was made to examine the stable crack‐growth process in silica glass under several environmental conditions. The temperature and humidity influence on the crack‐growth process was investigated in detail. Test results show that the transition from region I to region II occurs at a constant stress intensity factor, K , independent of temperature and humidity. The transition K value was determined to be 0.61 MPa.m 1/2 . Furthermore, it is clear that the crack‐growth rate is dependent on K , even in region II.
No takes yet. Share an insight, caveat, or question.
Hibino et al. (1984) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:
More from Journal of the American Ceramic Society