Novel 2,2′,6,6′‐tetrabromo‐3,3′,5,5′‐tetramethyl‐4,4′‐biphenol (TBTMBP), and its epoxy derivatives, were synthesized to incorporate the stable meta‐brominated phenol moiety into epoxy resin systems. In electronic encapsulation and laminate applications, epoxy systems derived from TBTMBP have exhibited superior hydrolytic and thermal stability as compared with the conventional ortho‐brominated epoxy resins. These properties have resulted in an extended device life for semiconductors and a highTgwith excellent blister resistance for the printed circuit board, while meeting flame retardancy requirements as well.
No takes yet. Share an insight, caveat, or question.
Wang et al. (1991) studied this question.
Synapse has enriched 5 related papers. Consider them for comparative context: