A low temperature process for transferring carbon nanotube (CNT) film from a silicon wafer to a copper surface via conductive polymer composites is proposed. The morphologies and electrical properties of the transferred CNT films were studied. An ohmic contact was formed between a CNT film and a highly conductive polymer composite and the resistance of the as-transferred CNT film was 0.08 Ω, while a semiconductor joint was formed between a CNT film and a high resistivity polymer composite.
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Jiang et al. (2007) studied this question.
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