Fabrication of high density multichip modules

The fabrication steps necessary to build high-density multichip module substrates are reviewed, and some of the complex process decisions needed to obtain a system which will eventually be produced in high volumes are discussed. Thin-film-based high-density multichip modules are necessary to achieve satisfactory performance in new electronic designs. Substrates built with vacuum-deposited metal and polymeric insulators have evolved in much more complex structures than traditional thin film hybrid.>