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N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylalkane epoxy resins with alkyl substituents on the methylene carbon were synthesized and characterized. The thermal and dynamic mechanical properties of these resins when cured with diaminodiphenylsulfone were compared with those of the cured unsubstituted epoxy resin. Although the resins have similar structures, the cured resin from the unsubstituted epoxy has the higher polymer decomposition temperature and glass transition temperature. The substituted epoxy resins have higher dynamic Young's moduli and loss moduli.
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Liu et al. (1985) studied this question.
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