This paper reviews recent progress in the integration and packaging of two-dimensional (2D) vertical-cavity surface-emitting laser (VCSEL) arrays being developed for the use in high-speed parallel optical interconnections. It reviews the smart integration of VCSEL's with detecting, switching and latching functions through the integration of a VCSEL-thyristor and double-cavity phototransistor. It also describes self-alignment-packaging technologies for 2D VCSEL module that can be used in high-density parallel links. Various system applications, such as a distributed fiber switch used to enable crossbar interconnections with address switching functions and hyper-parallel transmission using an image fiber, are also examined.
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Hideo Kosaka (1999) studied this question.
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