In situobservation of the grain growth of the copper electrodeposits for ultralarge scale integration

The grain growth which occurs during the self-annealing in copper electrodeposits was investigated by in situ observation with an electron backscattered diffraction technique. From these observations, it was found that a newly created twin was initiated on the front interface of growing twin and that the transverse direction for the growth was ⟨110⟩. Most of the twins had the Σ3 twin boundary of {111}⟨110⟩. The formation of the twin and its peculiar growth direction could be explained quite well based on the hypothesis that the growth front interface is one of the {111} planes.