We have performed numerical calculations to study the generation of arbitrary temperature profiles with high spatial resolution on the surface of a solid. The characteristics of steady-state distributions and time-dependent heating and cooling cycles are examined, as well as their dependence on material properties and device geometry. Ideally, low-power consumption and fast response times are desirable. The simulations show that the achievable spatial resolution is on the order of the substrate thickness and that the response time t+ depends on the width of the individual heating elements. Moreover, the rise time t+ can be significantly shortened by deposition of a thermal insulation layer, which also reduces the power consumption and increases lateral resolution.
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Darhuber et al. (2002) studied this question.
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