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This paper describes the influence of diamond nanoparticles on the modification of the thermal properties of benzocyclobutene (BCB) which is used for three‐dimensional (3D) wafer‐to‐wafer integration. Hybrid nanocomposites containing mixtures of 0.5–10 weight% (wt.%) diamond nanoparticles [average particle size (APS): 10 nm] in BCB were analyzed using thermal gravimetric analysis (TGA) and flash diffusivity techniques. Measurements show that the addition of nanoparticles significantly increases the decomposition temperature. Diffusivity measurements and subsequent calculations of thermal conductivity suggest that the inclusion of nanoparticles only slightly improves the conductivity.
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Gracias et al. (2010) studied this question.
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