This paper focuses on the preparation of near‐net‐shaped dense T i 3 S i C 2 ‐based materials via an indirect three‐dimensional printing (3 D printing) and postreactive melt infiltration ( RMI ) processes. T i C preforms with bimodal pore size distribution were fabricated through 3 D printing, followed by the infiltration of Si melt and Al–Si alloy ( A l 40 S i 60 and A l 70 S i 30 ). Dense composites with density of ~4.1 g/cm 3 were obtained after the infiltration. No volume shrinkage was obtained after the reactive infiltration with A l–Si alloy. The participation of Al during the infiltration process promoted the formation of T i 3 S i C 2 . The as‐fabricated T i 3 S i C 2 ‐based materials showed enhanced mechanical and electromagnetic interference shielding properties.
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Ma et al. (2014) studied this question.
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