Co-Packaged Optics - Heterogeneous Integration of Chiplets (Switch, Photonic IC, and Electronic IC)

There have been strong demands for lower power consumption and higher bandwidth in optical/electrical interconnects used for artificial intelligence (AI) and networks in a data center. The adoption of co-packaged optics (CPO) has been expected for both high-performance computing (HPC) driven by AI and high-bandwidth and high-speed communications networks in a data center. In this study, on-board optics (OBO), near package optics (NPO), and CPO will be discussed. Emphasis is placed on 3D heterogeneous integration of chiplets such as photonic integrated circuits (PIC), electronic integrated circuits (EIC), and application specific IC (ASIC) switch w/o bridges on CPO substrates, e.g., organic, silicon, and glass. Some recommendations will be provided.