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October 1, 1996Journal of The Electrochemical Society

Improved Within‐Wafer Uniformity Modeling Through the Use of Maximum‐Likelihood Estimation of the Mean and Covariance Surfaces

Joseph C Davis Jacqueline M. Hughes‐Oliver Jye‐Chi Lu R.S. Gyurcsik

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Abstract

Improved Within‐Wafer Uniformity Modeling Through the Use of Maximum‐Likelihood Estimation of the Mean and Covariance Surfaces, Davis, Joseph C., Hughes‐Oliver, Jacqueline M., Lu, Jye‐Chi, Gyurcsik, Ronald S.

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Davis et al. (1996) studied this question.

synapsesocial.com/papers/6a9f8bfc3c7dd4a1896902fc https://doi.org/10.1149/1.1837220

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