Laser-patterned interconnect for thin-film hybrid wafer-scale circuits

High-performance electronic systems are often constrained by conventional packaging and interconnection technologies. A new technique is described for electrically connecting integrated circuit chips to a silicon wafer interconnection substrate, enabling future fabrication of hybrid wafer-scale circuits to be performed exclusively with thin-film interconnection technology. Thin-film wiring is fabricated down beveled edges of the chips and patterned using discretionary laser etching techniques. Interconnections on a 25-µm pitch (1600 wires around a 1-cm square chip) were achieved with this approach. Functioning hybrid memory modules have been fabricated to demonstrate feasibility of the technology.