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The process of ball/wedge bonding and its advantages are described. A capacitor discharge technique for the formation of balls on 25 and 75 μ m diameter aluminium wires is discussed. Ultrasonic welding trials were carried out and the bonds subjected to pull tests with good results. Bonds of good strength were made between 25 μ m diameter Al‐1% Si wire and Al thin films, Pd‐Au thick films and Au flashed Kovar.
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Dawes et al. (1980) studied this question.
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