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January 1, 2002Journal of The Electrochemical Society

Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole

Wenbo Yu Yan Zhang E. T. Kang K. G. Neoh Shuangye Wu Y. F. Chow

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Abstract

Electroless Plating of Copper via a Sn-Free Process on Dielectric SiLK Surface Modified by UV-Induced Graft Copolymerization with 4-Vinylpyridine and 1-Vinylimidazole , Yu, W. H., Zhang, Yan, Kang, E. T., Neoh, K. G., Wu, S. Y., Chow, Y. F.

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Yu et al. (2002) studied this question.

synapsesocial.com/papers/6a9fc0ab6e77178a3bd558e0 https://doi.org/10.1149/1.1507785

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