Nondestructive Analysis of Interconnection in Two-Die BGA Using TDR

Nondestructive analysis (NDA) is one of the most important tasks that is performed during the industrial characterization of integrated circuits (ICs) because even a tiny defect or failure in the IC packages could be disastrous from the standpoint of quality control. To detect an interconnection failure in IC packages, a time-domain reflectometry (TDR) analysis system was developed. An open-end fixture (OEF) was employed to detect the rapid rise of edge signals from the package and to monitor them under the two parameters of time interval and reflection voltage. We developed a simple and effective electrical NDA system based on the TDR technology that can evaluate the interconnection of ball grid array (BGA) packages. The TDR-measurement results can determine both the failure location and type based on the aforementioned parameters for a two-die BGA package.