The effect of the addition of p‐aminophenol and aniline‐based epoxy diluents on the curing behavior of highly viscous tetraglycidyl diamino diphenyl methane resin with diamino diphenyl sulfone hardener have been investigated kinetically by differential scanning calorimetry. Dynamic scans were carried out over a temperature range 30–300°C for different resin formulations. Isothermal scans at four differnt temperatures have also been carried out for the evaluation of kinetic parameters. Heat flow measurements at different heating rates have indicated the evidence of autocatalytic behavior of curing reaction following a simple nth‐order kinetics.
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Jagadeesh et al. (1990) studied this question.
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