We describe a method of metal deposition by electron beam exposure and pyrolysis of a gold containing organometallic polymer. Commercial gold containing solutions were used as negative electron beam resists with line dose sensitivities of about 0.2 μC/cm as developed in methylene chloride. We have demonstrated the formation of metal patterns on Si, GaAs, and polyimide with linewidths as small as 0.25 μm.
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Craighead et al. (1986) studied this question.
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