Metallic conductive LaNiO 3 thick films with a thickness of 0.5–10 μm were fabricated by a room‐temperature‐operating powder deposition process—aerosol deposition method. The coated LaNiO 3 layers were fairly dense without pores or cracks, and maintained their phase stability due to low‐temperature consolidation. The as‐deposited LaNiO 3 film consisted of ∼10‐nm‐diameter grains, with a sheet resistance of 10–100 Ω/□, while the post‐annealed LaNiO 3 film had a sheet resistance of 4.45 Ω/□, which is the lowest value ever reported for an LaNiO 3 film. This excellent conductivity result was attributed to the high crystal stability and dense microstructure.
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Choi et al. (2008) studied this question.
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