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Diamond films grown on silicon were polished to a root-mean-square roughness of 15 nm and bonded to (100) silicon in a dedicated ultrahigh vacuum bonding chamber. Successful bonding was observed at temperatures as low as 950 °C under a uniaxial mechanical stress of 32 MPa. Scanning acoustic microscopy indicated complete bonding at fusion temperatures above 1150 °C, and some cracking of the diamond film. Cross section transmission electron microscopy of the same specimens revealed an intermediate layer consisting of silicon, carbon, and oxygen. This layer was approximately 30 nm thick and had an amorphous structure.
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Yushin et al. (2002) studied this question.
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