This letter examines the effect of oxygen (O2) high-pressure annealing (HPA) on indium zinc oxide (IZO) thin-film transistors (TFTs) with a high-quality Al2O3passivation layer. The IZO TFTs anneal under an O2atmosphere at 9 atm exhibits a high field-effect mobility, low subthreshold gate swing, moderate threshold voltage (Vth), and high ION/OFFratio of 30.4 cm2/Vs, 0.10 V/decade, 0.79 V, and 108, respectively. In addition, the O2HPA-treated IZO TFT has superior reliability (ΔVth= -0.5 V) to that of the 0.2-atm-annealed device (ΔVth=-3.7 V) under negative bias illumination stress conditions. This improvement can be attributed to the reduced concentration of oxygen vacancy defects in the IZO channel layer during the O2HPA treatment.
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Park et al. (2013) studied this question.
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