Results are presented on GaAs MESFET devices with nonalloyed ohmic contacts fabricated using a graded (InGa)As cap layer. Nonalloyed contacts do not require the ohmic alloy step and have much smoother morphology than alloyed metal contacts, permitting more reproducible and accurate gate-level lithography. Specific contact resistances of 1*10/sup -7/ Omega -cm/sup 2/ were measured on FETs that exhibited g/sub m/=210 mS/mm and f/sub t/=23 GHz at 300 K for devices with 0.6- mu m gate lengths.>
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Eschrich et al. (1989) studied this question.
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