Self-aligned hybrid integration of semiconductor lasers with micromachined micro-optics for optoelectronic packaging

Novel self-aligned hybrid integration of semiconductor lasers with three-dimensional micro-optical components has been demonstrated. The self-alignment structures are fabricated integrally with other three-dimensional micro-optical elements such as micro-Fresnel lenses, mirrors, and gratings on a single Si chip by surface micromachining technology. The Si substrate serves as a free-space micro-optical bench for active and passive optoelectronic components. A divergent beam emitted from an edge-emitting semiconductor laser has been successfully collimated by the integrated micro-Fresnel lens. The integration scheme offers a new approach for optoelectronic packaging and a new technology platform for integrating complete free-space micro-optical system on a single chip.