Physical and Chemical Properties of Titania‐Silica Films Derived from Poly(ethylene glycol)‐Containing Gels

Physical and chemical properties of poly(ethylene glycol) (PEG)‐containing TiO 2 ‐SiO 2 gel films have been studied relative to their application to the fine‐patterning technique for optical memory disks. PEG added to TiO 2 ‐SiO 2 gel films decomposed completely at temperatures between 250° and 300°C. The combustion of PEG in the gel films led to decreases in the refractive index and in the hardness of the films, which should result from the increase in porosity of the films. The addition of PEG into the gel films, however, did not adversely influence the weathering resistance of the glass substrates coated with the sol‐gel‐derived films.