Hertzian Stress Cracks in Beryllia and Glass

The effect of Hertzian stresses resulting from loads acting at the points of contact of beryllia spheres was determined. As‐drawn glass and glass ground with various grades of silicon carbide were indented with beryllia spheres, 1 in. in diameter. Also, pairs of these beryllia spheres were pressed together. Circular cracks due to Hertzian stresses were produced; an optical technique was developed for detecting them in a beryllia surface. The outer crack radius was proportional to the cube root of the maximum applied load. Average values obtained for the respective inner crack radii were used to determine average values of the minimum load to fracture these materials. The average minimum load to fracture 1 in. diameter beryllia spheres in air at room temperature under dynamic loading was 235 1b. The crack radius in glass and beryllia was about 20% greater than the radius of the contact surface. This was not significantly affected (in glass) by flaw density. It is considered that the Hertz analysis does not give the correct location and value of the maximum tensile stress when finite displacements of material occur.