The curing reaction kinetics of an epoxy based on the diglycidyl ether of bisphenol A (DGEBA) with an inorganic complex based on nickel(II) chelate with ethylenediamine (en) as a ligand were studied using DSC in dynamic mode. The complex curing agent was synthesized and characterized by the elemental analysis, FT‐IR, and ICP‐Plasma techniques. Thermal dissociation behavior of curing agent was also studied using thermogravimetric (TG) analysis in isolated form. Three kinetic models, Kissinger, Ozawa‐Flynn‐Wall, and Expanded Freeman‐Carrole, were used to determine the kinetic parameters. The effect of hardener concentration on the kinetic parameters and the shape of DSC thermograms of the DGEBA/Ni(en)3Br2 system were investigated. Finally, the previous proposed mechanism by another researcher was used to explain the DSC data in detail.
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Ghaemy et al. (2005) studied this question.
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