Selective Electroless Deposition of Cu on an Ultrathin Au Film Pattern

Summary: In this report an ultrathin Au nanoparticle (AuNP) film composed of photosensitive diazoresin (DR) and mercaptophenol (MP) capped AuNPs (MP‐AuNPs) was fabricated by self‐assembly (SA). The DR/MP‐AuNP film was then patterned through a photomask by selective exposure to UV light and instantly developed in sodium dodecyl sulfate (SDS) aqueous solution. After sintering at 550 °C to remove the organic components, the DR/MP‐AuNPs formed AuNPs. Taking advantage of the catalytic susceptibility of AuNPs toward electroless deposition of Cu, a Cu film micropattern with fine resolution (ca. 2–3 μm) and considerable thickness (ca. 130 nm) was prepared. SEM image of the micropatterned Cu film on a silicon substrate; scale bar: 10 μm. magnified image SEM image of the micropatterned Cu film on a silicon substrate; scale bar: 10 μm.