The mechanical properties of atomic layer deposition (ALD) coatings play a key role in their long‐term use as encapsulation barriers for organic‐based, flexible, electronic devices. Nano‐indentation characteristics and flexure testing of nanometer‐scale alumina on polyamide 6 (PA6) films are investigated to determine the influence of a sub‐surface hybrid layer formed during the ALD process. This hybrid layer is observed to affect the mechanical performance of the thin films, in particular at lower processing temperatures. This work has important consequences on how ALD materials need to be applied and evaluated on polymers for application as encapsulation barrier layers.
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Sun et al. (2013) studied this question.
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