Synthesis and characterization of a new imide compound containing phthalonitrile and phenylethynyl end-groups

The phthalonitrile and/or phenylethynyl end-capped imide compounds (3PN3PEODPA, 3PNODPA, 3PEODPA) are synthesized and characterized. The rheological results show the curing rate of 3PN3PEODPA slowed down compared with the phenylethynyl compound, while significantly accelerated compared with the phthalonitrile compound. And there is a relatively large process window of the compound 3PN3PEODPA. In situ infrared characterization indicates that the introduction of phenylethynyl into the phthalonitrile system accelerates the C≡N curing process. Furthermore, the cured polymers exhibit excellent thermal stability. Combining their own curing characteristics may offer a new type of resin systems with adjustable processability and tailored properties. The results offer promise for seeking new routine to design high-performance thermosetting materials.