The feasibility of using a thiosulfate-sulfite bath to electrodeposit soft gold for microelectronic applications has been investigated. This bath is stable at near-neutral pH, shows good compatibility with positive photoresists, and does not contain any additives. It was found that the bath produced gold bumps with straight sidewalls, flat top surfaces, and a good reproduction of the resist pattern was achieved. The thickness uniformity, roughness, stress, hardness, adhesion, and shape of the plated structures were found to be compatible with the requirements for a wide range of microelectronic applications, including wafer bumping.
No takes yet. Share an insight, caveat, or question.
Green et al. (2003) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: