Abstract (Pb0.97L0.02)(Zr0.95Ti0.05)O3 (PLZT) antiferroelectric thick films with (100) and (110) orientation were fabricated on platinum and LaNiO3‐buffered silicon substrates through a modified sol–gel process. It was demonstrated that the PLZT thick films with (110) preferred orientation had an enhanced electric‐field‐induced strain, by 77% as compared to the films with (100) orientation. Also, the antiferroelectric–ferroelectric switching field for the PLZT thick films with (110) orientation was 200 kV/cm, which was much lower than that (256 kV/cm) of the (100) oriented films. Moreover, the fatigue behavior of the PLZT thick films on LaNiO3 electrodes was much better than that of the films on platinum electrodes. (© 2009 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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Hao et al. (2009) studied this question.
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