Fabrication Processes for a Silicon Substrate Package or Integrated Gallium Arsenide Laser Arrays

Single crystal silicon substrate chips with preferentially etched V‐groove structures have been fabricated to accurately hold optical fibers for efficient output coupling of integrated gallium arsenide laser arrays. In addition, the substrate contains individually addressable drive electrodes electrically isolated by reversed biased p‐n junctions. This paper discusses the required fabrication and processing techniques necessary to achieve the silicon package utilizing batch‐processing technology found in the manufacture of microelectronic devices.