Improved adhesion of epoxy resin to copper metal has been achieved by pre‐treating copper with benzotriazole solution. The coupling mechanism and the interfacial reactions have been investigated by using X‐ray photoelectron and FTIR spectroscopies, and differential scanning calorimetry. It was found that benzotriazole reacted with copper metal in the presence of oxygen to form benzotriazolato Cu(I) and bis(benzotriazolato) Cu(II), which covered the surface of copper metal in a shape of polymeric thin layer. As the pre‐treated copper was heated with epoxy compound, it could induce the crosslinking to form interfacial chemical bonds.
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Xue et al. (1991) studied this question.
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