Mechanical and electrical properties of carbon‐nanotube‐reinforced Cu–Ti alloy matrix composites

It is known that there is a very weak bonding between carbon nanotube (CNT) and pure copper matrix since copper is known to be naturally nonwetting with CNT. In this study, the titanium is applied as a matrix‐alloying element and the CNT‐reinforced copper–titanium (Cu–Ti) alloy composites (Cu–Ti/CNT) are fabricated by a powder metallurgical method. The results show that Cu–Ti/CNT composites evidently exhibit enhanced interfacial bonding and yield strength while retaining the electronic conductivity of Cu/CNT composites. Improvements in interfacial bonding and mechanical properties of the composites are attributed to the formation of a thin transition layer of TiC at the interface between CNTs and Cu–Ti matrix.