This Letter reports a GaN-on-Si HEMT technology with 60 to 150 nm T-gate achieving simultaneous high efficiency and low noise at low voltage (3-6 V) RF operation, suitable for monolithic integrated FR2 mobile Transmit/Receive (T/R) modules. At 30 GHz and VDS = 5 V, in continuous wave operation, the fabricated Lg = 100 nm device delivered a saturated output power of 1.2 W/mm with a record-high peak power-added efficiency (PAE) of 62% while maintaining a state-of-the-art minimum noise figure (NFmin) of 1.1 dB. Enabled by the optimized epitaxial structure and fabrication process, the proposed technology, even with moderate scaling, offers a cost-effective solution for FR2 T/R modules.
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Zhuang et al. (2026) studied this question.
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