The Design of Filler Morphology and Orientation: Two Pivotal Strategies for the Optimization of Thermal Transport in Thermal Interface Materials

The continuous advancement in the integration density of microelectronic devices, as well as the development of high‐frequency devices in the background of green energy, has drawn increasing attention to the issue of heat dissipation. Taking IGBTs as an example, although higher power density can improve the output electrical quality, the numerous temperature cycles experienced by the device, compounded by the coefficient of thermal expansion (CTE) mismatch between the multi‐layer materials, severely exacerbate device failure. At this time, thermal interface materials (TIMs) play an irreplaceable role in reducing the temperature failure during this period. However, traditional polymer‐based TIMs with randomly dispersed fillers have low thermal conductivity (TC), and new strategies need to be developed urgently. This paper reviews the morphology and types of thermal fillers with a focus on discussing the synergistic effect of these factors on the thermal conductivity. Furthermore, the review also highlights the enhancement effect of improving the continuity and orientation of the fillers as advanced strategies on the thermal conductivity, aiming to provide theoretical guidance and technical references for the design of next‐generation efficient thermal management materials.