Thermally Detachable Conformal Electromagnetic Interference Shielding Film With Segregated Conductive Networks for Repairable Electronics

The escalating demand for miniaturized and high‐frequency electronics necessitates next‐generation electromagnetic interference (EMI) shielding materials that offer both conformal adaptability and repairability. Herein, we present a thermally detachable conformal shielding film (DCSF) comprising thermally expandable microspheres (TEMs), silver flakes (Ag), thermoplastic polyurethane (TPU), epoxy resin (EP). The TEMs induce a segregated conductive network within the DCSF, enabling exceptional electrical conductivity of 10884 ± 211 S·cm −1 and ultralow contact resistance of 1.30 ± 0.01 mΩ·mm −2 . The formation of the Ag‐TPU/EP‐TEM heterogeneous interface enhances multiple reflections and interface scattering of electromagnetic waves, achieving outstanding EMI shielding effectiveness of 93.7 ± 0.4 dB and near‐field shielding effectiveness of beyond 56 dBm. Crucially, the embedded TEMs facilitate on‐demand detachment from printed circuit board assemblies (PCBAs) upon heating above 180°C. This detachment mechanism operates via isotropic interfacial stresses generated during volumetric expansion of the TEM, significantly reducing the film‐substrate contact area. Consequently, the DCSF enables residue‐free removal without damaging underlying electronic components. By simultaneously addressing critical challenges in EMI suppression and component reparability, the DCSF provides a novel strategy for solvent‐free and mechanically nondestructive electronics recovery holding significant promise for sustainable consumer electronics.